X12DPG-OA6
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Key Features
- 1. 3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
- 2. Intel® C621A
- 3. Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 8GB Unbufferred ECC Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 32 DIMM slots
- 4. 16 PCI-E 4.0 x8
M.2 Interface: 2 PCI-E 4.0 x4
M.2 Form Factor: 2280/22110
1 PCI-E 4.0 x16
- 5. 1 VGA port
- 6. Networking options provided via Ultra RiserDual LAN with 1GbE LAN via Intel® i350-AM2
Specifications
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Parts List
| Parts List (Bulk Package) | |||
| Name | Part Number | Qty | Description |
| Motherboard | MBD-X12DPG-OA6 | 1 | X12DPG-OA6 Motherboard |
| -- | |||
Chassis
(Optimized for
X12DPG-OA6
)| Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
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= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU

