슈퍼솔루션

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

X11DDW-L

Print

Key Features

  • • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
  • • Intel® C621
  • • Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
  • • 1 PCI-E 3.0 x32 Left Riser Slot,1 PCI-E 3.0 x16 Right Riser Slot,1 PCI-E 3.0 x16 for Add-On-Module (AOM)M.2 Interface: PCI-E 3.0 x4M.2 Form Factor: 2242, 2260, 2280, 22110M.2 Key: M-Key
  • • 1 VGA port
  • • Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • • Dual LAN with GbEfrom C621
Specifications
Product SKUs
MBD-X11DDW-L
  • X11DDW-L
 
Physical Stats
Form Factor
  • Proprietary WIO
Dimensions
  • 12.3" x 13.4" (31.24cm x 34.04cm)
 
Processor/Cache
CPU
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
  • Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Note
  • BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
 
System Memory
Memory Capacity
  • Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
  • RDIMM: 64GB, 128GB
  • LRDIMM: 64GB, 128GB
  • 3DS LRDIMM: 128GB, 256GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
Chipset
  • Intel® C621
SATA
  • Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
  • ASPEED AST2500
Network Controllers
  • Dual LAN with GbE
    from C621
Graphics
  • Aspeed AST2500 BMC
 
Input / Output
LAN
  • 2 RJ45 Gigabit Ethernet LAN ports
USB
  • 6 USB 3.0 ports (4 rear + 2 headers)
Video Output
  • 1 VGA port
TPM
  • 1 TPM Header
Expansion Slots
PCI-E
  • 1 PCI-E 3.0 x32 Left Riser Slot,
  • 1 PCI-E 3.0 x16 Right Riser Slot,
  • 1 PCI-E 3.0 x16 for Add-On-Module (AOM)
    (Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)
M.2
  • M.2 Interface: PCI-E 3.0 x4
  • Form Factor: 2242, 2260, 2280, 22110
  • Key: M-Key
 
System BIOS
BIOS Type
  • UEFI 256Mb
 
Management
Software
  • Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
 
PC Health Monitoring
Voltage
  • +1.8V, +12V, +3.3V, +5V, +5V standby, Memory Voltages, Monitors CPU voltages
FAN
  • 6x 4-pin fan headers (up to 6 fans), 6 fans with tachometer status monitoring, PWM fan speed control, Status monitoring for speed control
Temperature
  • CPU thermal trip support, Monitoring for CPU and chassis environment
LED
  • CPU / System Overheat LED, UID/Remote UID, BMC/IPMI Heartbeat LED, Power LED
Other Features
  • Chassis intrusion detection, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, Node Manager Support, RoHS, UID
 
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Parts List
Parts List (Bulk Package)
Name Part Number Qty Description
X11DDW-LMBD-X11DDW-L1Motherboard
IO CableCBL-SAST-0388L-02 1IPASS to 4 SATA cable

Parts List (Retail Package)
Name Part Number Qty Description
X11DDW-LMBD-X11DDW-L1Motherboard
IO CableCBL-SAST-0388L-02 1IPASS to 4 SATA cable
Quick Reference GuideMNL-1907-QRG1Quick Reference Guide

Optional Parts List
Name Part Number Qty Description
TPM security module (optional, not included)AOM-TPM-9670V-SSPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module (optional, not included)AOM-TPM-9671V-S SPI capable TPM 1.2 with Infineon 9671 controller with horizontal form factor
Chassis (Optimized for

X11DDW-L

)
Embedded Compact 1U 2U 3U Mid/Mini-Tower             4U/Tower               
SC815TQC-R706WB2
SC815TQC-605WB
SC116AC2-R706WB2
SC113AC2-R706WB2
SC113AC2-605WB
SC825MBTQC-R802WB
SCLA15TQC-563W
1U Heatsink:SNK-P0067PSMB

SC823MTQC-R802WB
SC825MBTQC-R802WB
1U Heatsink:SNK-P0067PSMB

SC825TQC-R1K03WB
SC826BAC4-R1K23WB
SC825TQC-R802WB
2U Heatsink:SNK-P0068PS


= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU


Server (Optimized for X11DDW-L)